YL Electrical Equipment (Tianijn) Co.,Ltd.

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Products > Contactless card production line > > Manual Chip Re-bonding Machine YCR-1
Product name : Manual Chip Re-bonding Machine YCR-1
Item : YCR-1
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Details:

 Manual Chip Re-bonding Machine YCR-1

  Feature Description

This machine is designed for manually bonding the copper wire onto the contactless chip. The amplifier and display is equipped to ensure precise and quality bonding result.  It is necessary equipment in the process of contactless INLAY sheet or contactless card production.
 
Technical Parameters

1.        Speed: 2000 pcs per hour.

2.        Dimension: L500×W400×H500mm

3.        Weight: 60 KG      

4.        Power supply: AC220V 50/60HZ 



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